Yeah but the PCB inside the paperless device would be as sharp as a paper, not to mention the component thin legs such as electrolytic capacitors (although the majority of electronic components are tiny blocks surface-mounted, there are components that need to be welded in a THT (through-hole) fashion because their electrical contents can’t fit the small space of a SMD).
Yeah but the PCB inside the paperless device would be as sharp as a paper, not to mention the component thin legs such as electrolytic capacitors (although the majority of electronic components are tiny blocks surface-mounted, there are components that need to be welded in a THT (through-hole) fashion because their electrical contents can’t fit the small space of a SMD).